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Title:
THIN FILM PRODUCTION METHOD AND THIN FILM PRODUCTION DEVICE
Document Type and Number:
Japanese Patent JP2010189757
Kind Code:
A
Abstract:

To provide a thin film production method and a thin film production device by which unideposit film deposition can be perdeposited so as to achieve quality control.

In the thin film production method, a thin film deposition means, by which two or more kinds of thin films are selectively deposited on the main face of the substrate S while feeding the substrate S from either of the first substrate storage means 1 or the second substrate storage means 2 to the other, is arranged between a first substrate storage means 1 and a second substrate storage means 2 each storing a belt-like substrate, and the feeding direction of the substrate S is reversed for every time of depositing one layer of the thin films, further, the kind of the thin films is changed, and two or more kinds of thin films are successively laminated on the main face. The substrate storage means 1, 2 are provided with detection parts 7A, 7B detecting the thin film deposited on the belt-like substrate S, a film quality evaluation calculating part 8 where the film quality of the thin film detected by the detection parts 7A, 7B is evaluated, and a suitable interelectrode spacing is calculated is provided, and the interelectrode is controlled by an interelectrode command control part 9 by the calculated result of the film quality evaluation calculating part 8.


Inventors:
SHIMIZU HITOSHI
Application Number:
JP2009165501A
Publication Date:
September 02, 2010
Filing Date:
July 14, 2009
Export Citation:
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Assignee:
FUJI ELECTRIC HOLDINGS
International Classes:
C23C16/52; H01L31/04
Domestic Patent References:
JPH1022518A1998-01-23
JPH09195055A1997-07-29
Foreign References:
WO1999058740A11999-11-18
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Naomi Yoshida
Ayako Nakamura