Title:
薄型基板の製造方法及び製造装置
Document Type and Number:
Japanese Patent JP4073460
Kind Code:
B2
Abstract:
An easy and low-cost method of manufacturing a thin substrate reduced in surface wobbling by bonding two thin sheets together is provided. A step of bonding thin substrate sheets together is performed by using a device in which a spacer is incorporated into a turntable provided with a through-hole for air inflow. The thin substrate sheets are rotated on the turntable, to spin off and cure an adhesive for bonding.
More Like This:
Inventors:
Hiroshi Ido
Application Number:
JP2006115609A
Publication Date:
April 09, 2008
Filing Date:
April 19, 2006
Export Citation:
Assignee:
Hitachi Maxell Co., Ltd.
International Classes:
G11B7/26; G11B7/24015; G11B7/24024; G11B7/24027; G11B7/24038; G11B7/24047; G11B7/244; B29C65/54; B29L11/00
Domestic Patent References:
| JP200391970A | ||||
| JP2005353140A | ||||
| JP200048419A | ||||
| JP2005216426A | ||||
| JP2002319189A | ||||
| JP2005141804A |
Attorney, Agent or Firm:
Yusuke Hiraki