To lower the cost of firing of an electronic component and to improve the efficiency of the firing by a method wherein a sprayed coating obtained by releasing from a base a sprayed layer formed by thermal spraying of ceramic is made a thin-wall jig for the firing of the electronic component.
Ceramic such as alumina or zirconia is sprayed thermally on a base and a sprayed layer is released from the base and made a thin-wall jig for firing of an electronic component. The ceramic used herein is alumina or zirconia. The material of the base for spraying is not limited particularly and a metal such as steel, stainless steel or aluminum or a fired material of alumina or alumina-silica, or the like, can be used. Although the method for release is not limited particularly, a method of utilizing a difference in a thermal expansion coefficient (shrinkage percentage) between the sprayed layer and the base or a method of applying a release agent on the base beforehand can be reckoned on the assumption that the base is used repeatedly. The thermal capacity of this thin-wall jig is small and the jig is excellent in spalling resistance.
KONO KOJI
WAKIJIMA NAOHISA
NAKATANI FUMIO
NOBUHARA KENICHI
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