Title:
貫通孔カバー、および貫通孔への筒状部設置構造
Document Type and Number:
Japanese Patent JP7250645
Kind Code:
B2
Abstract:
To provide a through hole cover which can easily perform a filling operation of putty into the through hole.SOLUTION: A through hole cover 4 installed at a through hole 1a portion on a wall 1, includes: a fixing part 6 to be fixed on the wall 1 from one side P1 of the through hole 1a; and a cylindrical part 7. The cylindrical part 7 includes a facing surface 7a on an outer periphery which faces an inner peripheral surface of the through hole 1 with a gap Q. The cylindrical part 7 includes an annular rib 7b which projects from an outer periphery on the other side Q1 which is opposite to the one side P1 toward the inner peripheral surface of the through hole 1a. The fixing part 6 and the cylindrical part 7 are communicated with each other. Between the fixing part 6 and the cylindrical part 7, an opening 8 is provided for filling the gap Q with patty 11 from the one side P1.SELECTED DRAWING: Figure 6
Inventors:
Nakamura Atsushi
Application Number:
JP2019151339A
Publication Date:
April 03, 2023
Filing Date:
August 21, 2019
Export Citation:
Assignee:
Mirai Industry Co., Ltd.
International Classes:
F16L5/02; E04B2/56; H02G3/22
Domestic Patent References:
| JP201213124A | ||||
| JP201213125A | ||||
| JP2011144512A | ||||
| JP2004353787A | ||||
| JP20147893A | ||||
| JP201387828A |
Attorney, Agent or Firm:
Koji Hirose
Previous Patent: Coin handling system and coin handling equipment
Next Patent: METHOD FOR KEEPING WETNESS OF SALT
Next Patent: METHOD FOR KEEPING WETNESS OF SALT