Title:
【発明の名称】電子部品用接着テープ
Document Type and Number:
Japanese Patent JP2896751
Kind Code:
B2
Abstract:
Adhesive tapes which can be adhered and cured at a relatively low temperature, keeps enough electric insulation in case of adhering to the leadframe of semiconductor devices. The adhesive tape comprises a releasing film and an adhesive layer provided on a surface of said releasing film, said adhesive layer being semi-cured into a B-stage and composed of: (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight and an amino equivalent of 500-10,000, represented by the formula (I): (I) wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in a range of 10 to 900 parts by weight, and said adhesive layer being composed of at least two semi-cured layers having each a different status of semi-cure.
Inventors:
SAKUMOTO YUKINORI
HASHIMOTO TAKESHI
NISHIGAYA TAKESHI
YAMANASHI FUMYOSHI
HASHIMOTO TAKESHI
NISHIGAYA TAKESHI
YAMANASHI FUMYOSHI
Application Number:
JP9591795A
Publication Date:
May 31, 1999
Filing Date:
March 30, 1995
Export Citation:
Assignee:
TOMOEGAWA SEISHIJO KK
International Classes:
C09J7/00; C08F220/60; C08F279/00; C08F279/02; C08G73/00; C08G77/26; C09J7/02; C09J109/02; C09J119/00; C09J121/00; C09J133/02; C09J133/20; C09J133/24; H01L21/52; H01L23/40; (IPC1-7): C09J7/02; C08F220/60; C08F279/02; C08G73/00; C08G77/26; C09J109/02; C09J133/20; H01L21/52; H01L23/40
Domestic Patent References:
| JP8269406A | ||||
| JP7126592A | ||||
| JP7126591A | ||||
| JP6259678A |
Attorney, Agent or Firm:
Tsuyoshi Watanabe (1 person outside)