Title:
PRINTED WIRING BOARD FOR FLIP CHIP
Document Type and Number:
Japanese Patent JPH0697634
Kind Code:
A
Abstract:
PURPOSE: To surely prevent connection failure and short between an IC chip side pad and a flip chip pad, by making the area change of the flip chip pad very small.
CONSTITUTION: A wiring pattern 2 is formed on a substratum 1. Solder resist 3 is formed on the wiring pattern 2 by using a dry film composed of photo-sensitive resin. Circular apertures 4 are formed in the solder resist 3. A part of the wiring pattern 2 exposed from the apertures 4 is used as flip chip pads 6 for mounting an IC chip.
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Inventors:
YAMANAKA KYOICHI
IWAI TSUTOMU
IWAI TSUTOMU
Application Number:
JP24101992A
Publication Date:
April 08, 1994
Filing Date:
September 09, 1992
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/28; H05K3/34; (IPC1-7): H05K3/28; H05K3/34
Attorney, Agent or Firm:
Hironobu Onda