Title:
【発明の名称】低溶融点分散型樹脂を製造する方法
Document Type and Number:
Japanese Patent JPS58502219
Kind Code:
A
Abstract:
There is disclosed a process for producing low energy vinyl dispersion resins which, in a plastisol, can be fused either at lower temperatures or in a shorter period of time than the normal dispersion grade resins presently employed. The new vinyl resin is characterized by being a bimodal resin, i.e., containing large particles and small particles of polymer in a predetermined size and amount. The small particles are a vinyl homopolymer or copolymer made by a regular emulsion polymerization procedure. The large particles are a vinyl copolymer made employing a seeded emulsion overpolymerization procedure wherein the seed is either a vinyl homopolymer or a vinyl copolymer. The final bimodal resin is obtained from a blend of the small and large particle latices by drying, such as spray drying, for example.
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Inventors:
Yang Henry Wu-Cyan
Application Number:
JP50039483A
Publication Date:
December 22, 1983
Filing Date:
December 09, 1982
Export Citation:
Assignee:
Zabi -. F. Guddleitchi Company-
International Classes:
C08F2/00; C08F2/22; C08F220/10; C08F14/06; C08F259/00; C08F259/04; C08F; (IPC1-7): C08F14/06; C08F2/00
Attorney, Agent or Firm:
Aoki Akira