Title:
【発明の名称】鉛無含有半田合金
Document Type and Number:
Japanese Patent JP2805595
Kind Code:
B2
Abstract:
A lead-free solder consisting of 1 to 4 wt% of Ag, either one or both of Bi and In of their respective amounts meeting the conditions that the value of expression (1), A, is equal to or greater than 5.00 and that the value of expression (2), B, is equal to or less than 6.90, and Sn for the balance:
Inventors:
Ryuji Ninomiya
Junichi Matsunaga
Junichi Matsunaga
Application Number:
JP5669195A
Publication Date:
September 30, 1998
Filing Date:
February 21, 1995
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
B23K35/26; C22C13/00; (IPC1-7): B23K35/26
Domestic Patent References:
| JP788681A | ||||
| JP788680A | ||||
| JP5228685A | ||||
| JP5829198B2 |
Other References:
【文献】欧州特許出願公開629466(EP,A)
【文献】欧州特許出願公開499452(EP,A)
【文献】欧州特許出願公開568952(EP,A)
【文献】英国特許出願公開131299(GB,A)
【文献】欧州特許出願公開499452(EP,A)
【文献】欧州特許出願公開568952(EP,A)
【文献】英国特許出願公開131299(GB,A)
Attorney, Agent or Firm:
Takao Sato