PURPOSE: To bond the lead of a TAB device to the electrode of a panel element accurately and smoothly by aligning the lead of the panel electrode before coating a curing resin.

CONSTITUTION: A panel element PN is sucked by a suction part 4 for positioning on a support stand. A motor is driven to allow an upper surface 22a of a support plate 22 to oppose and to be the same level as a panel electrode PNb. A device P is sucked by a section hole 22b, a device P is positioned by the support plate 22, and the matching state of the panel electrode PNb and the lead L is observed from the lower part, thus performing alignment fully. In this state, no resin B is coated on a lead L and the panel electrode PNb, thus preventing observation from being disturbed by the resin B and achieving a smooth alignment. Then, an ultraviolet rays curing resin B is coated on the lead L and the lead L is pressed against the panel electrode PNb for curing the resin B.