Title:
MANUFACTURE OF FLEXIBLE CIRCUIT BOARD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3261064
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To use the board for an interposer of a semiconductor package by sticking a resin layer side of a surface insulation film wherein a resist layer and a resin layer are made integral to a wiring pattern side of a flexible circuit board and forming a surface insulation layer by processing a resin layer by a resist pattern.
SOLUTION: A surface insulation film wherein a resin layer 4 and a resist layer 5 are made integral is prepared in advance and the side of the resin layer 4 is sticked to the side of the wiring pattern 3 uniformly. The resist layer 5 is subjected to exposure/development treatment to be formed to a required shape and a place of the resin layer 4 exposed by a resist pattern 6 is subjected to chemical etching treatment for forming a required slit 7 and an opening part 8. After the resist pattern 6 is peeled, the resin layer 4 is subjected to curing treatment to be set and a surface insulation layer wherein the slit 7 and the opening part 8 are formed is formed. Thermoplastic polyimide resin, etc., are applied to an outer surface of the insulation base layer 1 and set and a thermoplastic resin layer 9 is formed.
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Inventors:
Shinichi Mimura
Shinichiro Suga
Shinichiro Suga
Application Number:
JP8877697A
Publication Date:
February 25, 2002
Filing Date:
March 24, 1997
Export Citation:
Assignee:
Nippon Mektron Co., Ltd.
International Classes:
H01L21/60; H01L23/12; H05K3/28; H05K3/40; (IPC1-7): H01L23/12; H01L21/60
Attorney, Agent or Firm:
Akimitsu Kamata
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