【発明の名称】ポリ(アリールエーテルベンズイミダゾール)およびそれを適用した電子パッケージ - International Business Machines Corporation

Title:

【発明の名称】ポリ(アリールエーテルベンズイミダゾール)およびそれを適用した電子パッケージ

Document Type and Number:

Japanese Patent JP3072704

Kind Code:

B2

Abstract:

A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.

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Inventors:

Key Wyarn
James El Hedrick Jr.
Jeffrey W. Labadi
Kang-Uk Lee
Robert J. Tovigue
Alfred Fybeck
George F Walker

Application Number:

JP16406495A

Publication Date:

August 07, 2000

Filing Date:

June 29, 1995

Export Citation:

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Assignee:

International Business Machines Corporation

International Classes:

C08G73/18; C08L71/00; H01L23/29; H01L23/31; H01L23/498; H01L23/532; H05K1/00; H05K1/03; (IPC1-7): C08G73/18; H01L23/29; H01L23/31

Other References:

【文献】米国特許5245044(US,A)

Attorney, Agent or Firm:

Hiroshi Sakaguchi (1 person outside)

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