WAFER AND WORKING METHOD THEREOF

Japanese Patent JPS5923524

A

PURPOSE:To get rid of generation of foreign substance caused by chipping, by a method wherein a contact part between outer circumferential line of a semiconductor wafer and an orientation flat or other removed part for positioning is chamfered. CONSTITUTION:In order to perform positioning on outer circumference of an Si wafer 1, an orientation flat 2 in linear form is formed and the circumference other than this part is chamfered into an arc-shaped part 3. In order to prevent generation of chipping, a contact part 4 between the arc-shaped part 3 and the flat 2 is made smooth without giving abrupt change. When (r)= radius of inscribed circle, R= radius of wafer, (a)= half length of part without chamfering (flat part) in removed part for positioning, (b)= half of total length of removed part for positioning before chamfering, the inscribed circle specified by 0-a<2>)/2{R-(R<2>-b<2>)<0.5>} is drawn from the center of wafer 1 towards the outer circumference and a resin 5 extending out of the circle and positioning at the contact part 4 is removed.

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MAEJIMA HIROSHI
NISHIZUKA HIROSHI
KOMORIYA SUSUMU
EGASHIRA ETSUROU

JP13194982A

February 07, 1984

July 30, 1982

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HITACHI LTD

B24D5/02; H01L21/02; C30B33/00; H01L21/304; H01L23/544; H01L29/06; (IPC1-7): H01L21/304

JPS5823430A

1983-02-12

Katsuo Ogawa (1 person outside)

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