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Title:
【発明の名称】半導体集積装置
Document Type and Number:
Japanese Patent JP2553568
Kind Code:
B2
Inventors:
KINUGASA NORIHIDE
Application Number:
JP16455987A
Publication Date:
November 13, 1996
Filing Date:
July 01, 1987
Export Citation:
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Assignee:
MATSUSHITA ELECTRONICS CORP
International Classes:
H03K23/58; C30B29/06; H03K21/00; H03K21/38; H03K23/00; (IPC1-7): H03K21/38; H03K21/00; H03K23/00; H03K23/58
Domestic Patent References:
JP58215121A
JP626531A
JP5725725A
Attorney, Agent or Firm:
Tomoyuki Takimoto



 
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