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Title:
【発明の名称】半導体製造装置
Document Type and Number:
Japanese Patent JP2695299
Kind Code:
B2
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JP7041144Devices and methods for controlling the airtightness of airtight containers for transport and storage of semiconductor substrates under atmospheric pressure.
Inventors:
Hosoi Koichi
Yuichi Kato
Application Number:
JP9300891A
Publication Date:
December 24, 1997
Filing Date:
March 29, 1991
Export Citation:
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Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/673; H01L21/68; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Hiroshi Murakami (1 outside)



 
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