Title:
【発明の名称】半導体センサ素子
Document Type and Number:
Japanese Patent JP2001508539
Kind Code:
A
Abstract:
A housing for a semiconductor sensor configuration, in which a sensor and an evaluation logic are integrated in a semiconductor body is disclosed. The housing has a base body upon which the semiconductor body is applied and a cover that encloses the semiconductor body in the base body. The cover is directly set on the base body of the housing and contains a membrane and/or labyrinth.
More Like This:
| JPH0552690 | PRESSURE DETECTOR |
| WO/2001/085511 | BRAKING DEVICE COMPRISING AN INTEGRATED PRESSURE SENSOR MODULE |
Inventors:
Teeth Jantzeck
Bernd Stadler
Detroit Houdew
Bernd Stadler
Detroit Houdew
Application Number:
JP53044298A
Publication Date:
June 26, 2001
Filing Date:
December 05, 1997
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
G01L9/04; B81B7/00; G01L9/00; G01L19/14; H01L23/02; (IPC1-7): G01L9/04; G01L19/14; H01L23/02
Attorney, Agent or Firm:
Toshio Yano (3 outside)