Title:
【発明の名称】面実装型ダイオード
Document Type and Number:
Japanese Patent JP2747634
Kind Code:
B2
Abstract:
A surface mounting type diode is provided which comprises: a diode chip; a pair of leads held in electrical conduction with the diode chip, each of the leads including an inner end, an outer end, a first bend closer to the inner end, a second bend closer to the outer end, and an intermediate portion between the first and second bends; and a resin package enclosing the diode chip together with part of the respective leads, the resin package having a flat bottom surface. The inner end, first bend, second bend and intermediate portion of the lead are contained in the resin package. Further, the outer end of the lead has an exposed flat mounting surface flush with the bottom surface of the resin package.
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Inventors:
SUNADA SHIGEMASA
Application Number:
JP27207992A
Publication Date:
May 06, 1998
Filing Date:
October 09, 1992
Export Citation:
Assignee:
ROOMU KK
International Classes:
H01L23/28; H01L21/56; H01L23/31; H01L23/48; H01L23/495; (IPC1-7): H01L23/28; H01L23/48
Domestic Patent References:
| JP217664A | ||||
| JP498861A | ||||
| JP614261A |
Attorney, Agent or Firm:
Minoru Yoshida (2 outside)