Title:
【発明の名称】温度補償回路
Document Type and Number:
Japanese Patent JPH0821839
Kind Code:
B2
Inventors:
IMAI KATSUMI
Application Number:
JP9955689A
Publication Date:
March 04, 1996
Filing Date:
April 19, 1989
Export Citation:
Assignee:
SANYO DENKI KK
International Classes:
H03K3/282; H03L1/02; (IPC1-7): H03K3/282; H03L1/02
Domestic Patent References:
| JPS5617519A | ||||
| JPS56157122A |
Attorney, Agent or Firm:
Koji Yasutomi (1 person outside)