Title:
CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH0661609
Kind Code:
A
Abstract:
PURPOSE: To realize significant downsizing of electronic appliance by increasing the surface mounting density of electronic components on a circuit board.
CONSTITUTION: A plurality of through holes 7 are made through an insulating board 4a and an electronic component 14 is mounted on the through hole 7. A land 12a is connected directly with the through hole 7 and each electrode part 14a of the surface mounted electronic component 14 is soldered to the land 12a on a pair of through holes 7.
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Inventors:
IDA KIYOSHI
SAKURAI SHIZUO
SHINKAWA SAKAE
OBARA YOZO
SAKURAI SHIZUO
SHINKAWA SAKAE
OBARA YOZO
Application Number:
JP24549392A
Publication Date:
March 04, 1994
Filing Date:
August 21, 1992
Export Citation:
Assignee:
HOKURIKU ELECT IND
International Classes:
H05K1/18; H05K3/34; H05K3/40; (IPC1-7): H05K1/18; H05K3/34; H05K3/40
Domestic Patent References:
| JPS60175480A | 1985-09-09 | |||
| JPS60167181A | 1985-08-30 |
Attorney, Agent or Firm:
Hirosawa Isao
Next Patent: PARALLEL CONNECTED CIRCUIT OF CHIP COMPONENT