PURPOSE: To obtain a solid-state image pickup device suitable for using in vacuum.

CONSTITUTION: The solid-state image pickup device is used by installing for a vacuum deposition over and a CCD image sensor 20 and a body 13 incorporating a circuit substrate 18 mounting electrical parts for driving the sensor 20 are made metallic in the device. Among the electrical parts, a pulse driver 21 to heat is covered with an aluminium foil 23. The aluminium foil 23 and the pulse driver 21 are sticked with a silicone rubber 22 and the aluminium foil 23 is connected to the body 13. Thereby, heat generated by the pulse driver 21 is released to the metallic body 13 by heat conduction so as to prevent the overheating of the pulse driver 21.