【発明の名称】電子部品搬送体の底材およびその製造方法

Title:

【発明の名称】電子部品搬送体の底材およびその製造方法

Document Type and Number:

Japanese Patent JP2795679

Kind Code:

B2

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Inventors:

KURAMOCHI SADAO
HASHIKAWA JUNICHI
AKIBA HIDETO
MOMOTOME MASAAKI

Application Number:

JP14263889A

Publication Date:

September 10, 1998

Filing Date:

June 05, 1989

Export Citation:

Assignee:

DAINIPPON INSATSU KK

International Classes:

B65D85/86; B65B15/04; B65B47/06; B65D73/02; B65D85/38; (IPC1-7): B65B47/06; B65B15/04; B65D73/02; B65D85/86

Domestic Patent References:

JP57129604U
JP61175109U

Attorney, Agent or Firm:

Kazuo Sato (3 others)

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