Title:
【発明の名称】回路パタ-ン打抜き用金型の製造方法
Document Type and Number:
Japanese Patent JPS6039224
Kind Code:
B2
More Like This:
| JPS59181089 | METHOD OF CUTTING SUBSTRATE CIRCUIT |
| JPH08129261 | COATING FILM PATTERNING METHOD |
Inventors:
TANAKA YASUYUKI
NAKAJIMA KAZUO
NAKAJIMA KAZUO
Application Number:
JP14419576A
Publication Date:
September 05, 1985
Filing Date:
November 30, 1976
Export Citation:
Assignee:
NIPPON MEKTRON KK
International Classes:
H05K3/04; B21D37/20; B23D35/00; B26F1/14; B26F1/26; G03F7/00; (IPC1-7): G03F7/00; B23D35/00; B26F1/14; C23F1/00; H05K3/04
Attorney, Agent or Firm:
Akemi Kamata