【発明の名称】半導体封止用エポキシ樹脂成形材料の製造方法

Title:

【発明の名称】半導体封止用エポキシ樹脂成形材料の製造方法

Document Type and Number:

Japanese Patent JP2780449

Kind Code:

B2

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Inventors:

Hiroki Yukishima
Takashi Urano
Fujino Masanobu
Hideyuki Chaki
Hiroshi Suzuki
Togawa Mitsuo

Application Number:

JP17123390A

Publication Date:

July 30, 1998

Filing Date:

June 28, 1990

Export Citation:

Assignee:

Hitachi Chemical Co., Ltd.

International Classes:

C08L63/00; C08G59/18; C08K3/36; C08L83/04; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08K3/36; C08L83/04

Domestic Patent References:

Attorney, Agent or Firm:

Kunihiko Wakabayashi

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