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Title:
MOUNTING METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0629334
Kind Code:
A
Abstract:

PURPOSE: To eliminate formation of voids in an undercoating resin to be filled in a gap between a semiconductor device and a circuit board.

CONSTITUTION: A semiconductor device 1 such as an IC chip is face down bonded on a circuit board 3 through a bump 2 to be bonded without wiring. Then, the board 3 on which the device 1 is bonded is placed fixedly on a stage 7 to be ultrasonically vibrated, and a part of a gap between the device 1 and the board 3 is coated with undercoating resin 4. Thereafter, the stage 7 is ultrasonically vibrated to bury all with the resin 4 to eliminate a void in the gap between the device and the board 3.


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Inventors:
KUZUHARA KAZUNARI
HASHIZUME JIRO
SAITO HIROSHI
Application Number:
JP18507192A
Publication Date:
February 04, 1994
Filing Date:
July 13, 1992
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H01L21/56; H01L21/60; (IPC1-7): H01L21/56; H01L21/60
Attorney, Agent or Firm:
Mikio Kawase (1 person outside)



 
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