PURPOSE: To reduce the loss of a heat energy and avoid the thermal deterioration of the sealing rubber packing of a cover, etc., by a method wherein portions of a core tube main unit near its object entrance side and its tail tube side are made of translucent quartz glass containing fine voids of specific sizes.
CONSTITUTION: A quartz glass core tube has an entrance side end part 2 through which treated objects are brought into and taken out of the tube on its right end and has a tail tube side end part 9 on its left end. The respective end parts are made of transparent quartz glass. In regions outside a heating zone and near both the end parts, translucent quartz glass parts 8 containing fine voids having diameters of 15-1000μm are provided. A sealing cover is mated with the tapered part of the entrance side end part 2 through which the treated objects such as wafers are brought into and taken out of the core tube with a sealing rubber packing in-between. With this constitution, in a semiconductor wafer heat treatment at a high temperature not lower than 1000°C, the temperatures of both end parts are lowered than the temperature of the heating zone and the service lives of both end parts can be extended.
KIMURA HIROSHI
NAKAMURA KAZUO
KENMOCHI KATSUHIKO
| JPS5623741A | 1981-03-06 | |||
| JP60129128B | ||||
| JPS6181648A | 1986-04-25 |