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Patent Searching and Data


Title:
ADHESIVE COMPOSITION FOR PLATING
Document Type and Number:
Japanese Patent JPH0711450
Kind Code:
A
Abstract:

PURPOSE: To form a plating layer excellent in adhesion by using epoxy resin, acrylonitrile-butadiene rubber, CaCO3 and an aniline-formaldehyde condensation product as the constituents of an adhesive compsn. for plating used at the time of electroless plating of heat resistant plastics with a metal.

CONSTITUTION: The top of an insulator such as heat resistant plastics is coated with an adhesive compsn. for plating obtd. by mixing 100 pts.wt. bisphenol A-diglycidyl ether type epoxy resin with 0.5-4.0 pts.wt. acrylonitrile-butadiene rubber and 50-100 pts.wt. CaCO3 or BaSO4 having ≤5μm particle diameter and ≤0.1wt.% water content and further adding an aniline-formaldehyde condensation product as an epoxy resin curing agent by an amt. required to cure the epoxy resin. The adhesive compsn. is heat-cured and the resulting cured layer is sand-blasted to expose the CaCO3. The exposed CaCO3 particles are leached out with an aq. sulfuric acid soln. and then electroless plating with a metal is carried out. A metal plating layer excellent in adhesion and having high peeling resistance is obtd. by electroless plating.


Inventors:
NONAKA TAKU
SASAKI SHINGO
KAMIMURA TOMOHISA
HAGINO TOSHIAKI
Application Number:
JP17597293A
Publication Date:
January 13, 1995
Filing Date:
June 23, 1993
Export Citation:
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Assignee:
DAIABONDO KOGYO KK
NIPPON DRAWING KK
International Classes:
C09J109/02; C09J121/00; C23C18/20; H05K3/18; H05K3/38; (IPC1-7): C23C18/20; C09J109/02; H05K3/18; H05K3/38
Attorney, Agent or Firm:
Tetsuro Maki (3 others)