Title:
【発明の名称】相分離構造物、該構造物を含む樹脂組成物、電子部品封止用成形材料および電子部品装置
Document Type and Number:
Japanese Patent JP3226550
Kind Code:
B2
Abstract:
The present invention provides a phase-separation structure comprising a phenoxy resin modified with a carboxylated elastomer, prepared from a phenoxy resin and a carboxylated elastomer, the resin and the elastomer constituting a phase-separation structure, wherein the light transmittance of the structure in a 75 mum-thick film form at a wavelength of 500 nm is not less than 10% of the light transmittance of the air, which is useful as adhesives, film materials, and molding materials for encapsulating electronic components.
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Inventors:
Atsushi Kuwano
Shinsuke Hagiwara
Shinsuke Hagiwara
Application Number:
JP51739198A
Publication Date:
November 05, 2001
Filing Date:
October 08, 1997
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G65/28; C08L13/00; C08L63/00; C08L71/00; C08L71/10; (IPC1-7): C08L71/10; C08G59/40; C08G65/28; C08L13/00; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP61228060A | ||||
| JP61228059A | ||||
| JP4266957A |
Attorney, Agent or Firm:
Kazuko Tomita (1 outside)
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