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Patent Searching and Data


Title:
FITTING DEVICE OF HEAT-SENSITIVE ELEMENT
Document Type and Number:
Japanese Patent JPS60334
Kind Code:
A
Abstract:

PURPOSE: To reduce the heat capacity of a heat-sensitive element and to improve heat responsiveness by forming a freely movable air layer around the heat-sensitive element and forming a cover consisting of a molded resin around the air layer.

CONSTITUTION: An drawing electrode 8 of the heat-sensitive element 1 and a core 2 of a twisted wire 4 are caulked and connected by a caulking terminal 16. The freely movable air layer M is formed around the heat-sensitive element 1 and the resin cover 17 molded with a resin is formed on the outside of the air layer M. A penetration hole 18 for ventilation is arranged on a position opposed to the heat-sensitive element 1 on the wall surface of the resin cover 17. The resin cover 17 has a cylindrical part 2 arranged with a pitch size almost equal to the bending size of the drawing electrode 8 of the heat-sensitive element 1 and the twisted wire 4 is inserted into the cylindrical part 2.


Inventors:
KASAI ISAO
Application Number:
JP10870883A
Publication Date:
January 05, 1985
Filing Date:
June 16, 1983
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01C7/04; G01K1/14; G01K1/18; G01K7/16; G01K7/22; (IPC1-7): G01K1/14; G01K7/16; H01C7/04
Attorney, Agent or Firm:
Toshio Nakao