MANUFACTURE OF SUBMOUNTING MEMBER

Japanese Patent JPS60145630

A

PURPOSE:To form a submounting member bonded with uniform fusible material in the desired thickness and shape without deposition method by forming the fusible material in the desired shape and thickness and thermally press-bonding the material to the submounting member body to coat thereon. CONSTITUTION:Ti-Pt electrodes 2, 3 are bonded to the front and back surfaces of a silicon wafer 1 (1a is a fine piece), the wafer is then cut in the prescribed size. Then, a submounting member body before bonding a fusible material 4 is provided. On the other hand, the material 4 such as PbSnAg is elongated as a foil, and punched by a die. The foil 4 punched by the die is placed at the prescribed position on the surface of the submounting member body of the silicon, heated so as not to melt the PbSnAg, and pressure is simultaneously applied from above. Then, a submounting member is obtained. At this time, the material 4 may be bonded in the degree so as not to displace the mounting position in case of moving the submounting member and mounting a semiconductor element on the member.

WO/1999/034434	EPOXY BLEEDING INHIBITOR AND METHOD OF PREVENTING EPOXY BLEEDING
JPS5914336	[Title of the device] Pressure welding type semiconductor device

IWASAKI NOBORU
NOGUCHI SHIYOUZOU

JP162184A

August 01, 1985

January 09, 1984

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NIPPON ELECTRIC CO

H01L21/52; H01L21/58; (IPC1-7): H01L21/58

Uchihara Shin

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