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Patent Searching and Data


Title:
MOLDED ANTISTATIC HIGH POLYMERIC RESIN ARTICLE
Document Type and Number:
Japanese Patent JPS5884828
Kind Code:
A
Abstract:

PURPOSE: The titled molded article, prepared by forming a thin film with specific contents of silicon atoms and oxygen atoms on the surface of a molded high polymeric resin article by using a compound containing silicon atoms, and having improved antistatic properties with improved durability.

CONSTITUTION: A polymerized film is formed on the surface of a molded article 1 consisting of a high polymeric resin, e.g. polyethylene (PE), polypropylene (PP) or polystyrene (PS), by the low-temperature plasmatic treatment, etc. of a compound containing silicon atoms, e.g. various silane compounds or gasifiable low-molecular weight siloxane compound, or the compound containing the silicon atoms is applied to the surface and if necessary irradited with a ctinic rasy, etc. to form a modified thin film 2 with 1W60atm% silicon atom and 7atm% or more oxygen atom contents higher than those in the surface of the untreted molded article measured by the elementary analysis according to the electron spectroscopy and preferably ≤2μm thickness and give the amined molded article.


Inventors:
ASAI MICHIHIKO
SHIMURA YUKIO
TSUDA KEISHIROU
UENO SUSUMU
NOMURA HIROKAZU
IMADA KIYOSHI
Application Number:
JP18334881A
Publication Date:
May 21, 1983
Filing Date:
November 16, 1981
Export Citation:
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Assignee:
KOGYO GIJUTSUIN
SHINETSU CHEM IND CO
International Classes:
B32B27/00; C08J7/00; C08J7/04; (IPC1-7): B32B27/00; C08J7/04; C08J7/10
Attorney, Agent or Firm:
Ryoichi Yamamoto