Title:
INSPECTING DEVICE FOR WAFER
Document Type and Number:
Japanese Patent JPS59139642
Kind Code:
A
Abstract:
PURPOSE:To extract wafers one by one even from any position in a jig by using a wafer pusher in a loader mechanism. CONSTITUTION:A wafer receiving jig 31 in which a wafer 17 is received is placed on a loader section 15. An empty wafer receiving jig 31 is mounted onto an unloader section 16. The wafer 17 is transported onto a sample base 22 through one-time advance of a push rod 30 for the unloader and the operation of a first carrier mechanism 19. An XY table 23 is moved to shift the sample base 22 up to a position 36 for inspection at the center, and the wafer is inspected. An acceptable wafer is inserted into an original receiving groove before the wafer is extracted from the wafer receiving jig 31 on the loader section 15 through the operation of a second mechanism 29 and a push rod 32 for the loader. A defective wafer 37 is received in the wafer receiving jig 31 on the unloader section 16 by the first carrier mechanism 19 and a third carrier mechanism 34.
Inventors:
NASHIHARA HIROSHI
MAEJIMA HIROSHI
TAKAGAKI TETSUYA
MAEJIMA HIROSHI
TAKAGAKI TETSUYA
Application Number:
JP856784A
Publication Date:
August 10, 1984
Filing Date:
January 23, 1984
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/66; H01L21/677; (IPC1-7): H01L21/66
Attorney, Agent or Firm:
Katsuo Ogawa