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Title:
FORMATION OF PHOTORESIST PATTERN
Document Type and Number:
Japanese Patent JPS595244
Kind Code:
A
Abstract:

PURPOSE: To obtain a photoresist pattern high in precision, by forming an amorphous semiconductor film having light absorptivity on a passivated base, coating the film with a photoresist, and projecting light from an exposure light source through a photomask on the photoresist to cause the semiconductor film to absorb the transmitted light.

CONSTITUTION: MOS transistors 1cW1f are formed on a quartz plate 1a, all their surface is passivated with a silicon nitride film 1b to form the passivated base, and the film 1b is coated with the light absorptive amorphous silicon film 10, and further, this film 10 is coated with the photoresist 3. Then, the photomask 5 is registered with the base, and exposure light is projected from an exposure light source from above the mask 5, and the film 10 is caused to absorb the light transmitted through the photoresist 3, thus enhancing adhesion of the photoresist 3, and precision of the pattern by the absence of reflected light and diffused reflected light.


Inventors:
SHIRAI SHIGENOBU
NAGATA SEIICHI
HOTSUTA SADAKICHI
KAWASAKI KIYOHIRO
SAITOU HIROKI
Application Number:
JP11484782A
Publication Date:
January 12, 1984
Filing Date:
July 01, 1982
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/30; G03F7/09; G03F7/20; H01L21/027; (IPC1-7): G03C5/08; G03F7/20; H01L21/30
Attorney, Agent or Firm:
Akira Kobiji (2 outside)



 
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