PURPOSE: To reduce external force applied to a glass sealing section on the connection of a lead terminal section, and to improve workability by leading out a lead outside a pipe, welding the pipe and the lead and hermetically sealing the inside of the pipe.
CONSTITUTION: The nose section of a lead 4 is penetrated into a pipe 10 and projected outside the pipe 10, and the intermediate section of the lead 4 is welded to the sealing pipe 10 to hermetically seal the inside of the pipe 10. When a press-in type semiconductor rectifier instrument is mounted, the rectifier instrument is pressed into a previously formed hole 9a in a radiator plate 9 made of a metal consisting of aluminum, etc. with the object of conduction and thermal conduction while the lead 4 to which a solder coating layer 11 is shaped is connected and fixed to a hole 12A formed to a printed substrate 12 by a solder material. A case 2 for the semiconductor rectifier instrument is tilted to a flat section in the radiator plate 9 at that time. When the lead 4 is connected to the printed substrate 12, external force is applied to the lead 4 from the outside and the lead 4 is corrected when the nose of the lead 4 and the position of the hole 12A in the printed substrate 12 are not conformed, but the lead 4 has elasticity and external force concentrates to a pipe welding section B, thus preventing a direct effect on a glass seal 6, then improving fitting capability.
SAKAGAMI TADASHI
NARITA KAZUTOYO
HITACHI HARAMACHI SEMI CONDUCT