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Title:
BONDING APPARATUS
Document Type and Number:
Japanese Patent JPS58185672
Kind Code:
A
Abstract:

PURPOSE: To provide a bonding apparatus capable of giving an adhesive layer of a uniform thickness and eliminating defects in living beat of a Saticon of VTR, by providing a spiralling press. jig.

CONSTITUTION: In a bonding apparatus which bonds a face sheet to a thin sheet comprising one part having a mechanism holding the face sheet and lifting it, with the other part having a spiralling press. jig, the face sheet held by a face sheet holder 1 is lifted by an automatic switch cylinder 5 and pressed against a spiralling press. plate 14. In a conventional apparatus in which spinning bonding only is used, the circumferential adhesive is thrown out and the one in the central part remains behind to cause the unevenness of an adhesive layer. However, by the titled apparatus, the evenness of an adhesive layer becomes improved and, for example, poor living beat of a Saticon of VTR is eliminated.


Inventors:
KONISHI HISAHIRO
ICHIKAWA MITSUO
Application Number:
JP6730682A
Publication Date:
October 29, 1983
Filing Date:
April 23, 1982
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01J9/233; C09J5/00; G11B33/02; (IPC1-7): C09J5/00; G11B1/00; H01J9/233
Attorney, Agent or Firm:
Toshiyuki Usuda



 
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