PURPOSE: To improve dampproofing by applying an alkyl silicate to a semiconductor element and a lead wire and forming a coating layer through baking when the semiconductor device is sealed with a resin composition.
CONSTITUTION: Methyl silicate, ethyl silicate and these oligomer and the like are made contain as an alkyl silicate group compound. Benzene, toluene, xylene, alcohols, ketones, chloroform, etc. are used as a solvent. The thickness of a coating after application and baking is made 10μm or less in order to obtain the desired concentration of a solution. A baking temperature is at least 100°C or more, preferably, 150W300°C, and the device is treated for several min W several hr. A composition using an epoxy resin as a base is particularly preferable as the resin composition for sealing.
| JP2007269932 | HYDROPHILIC COMPOSITION AND HYDROPHILIC MEMBER |
| JPS61214131 | PRODUCTION OF MAGNETIC RECORDING MEDIUM |
SUGAWARA YASUHIDE
TSUBOSAKI KUNIAKI
