Title:
WAFER CHUCK
Document Type and Number:
Japanese Patent JPS594044
Kind Code:
A
Abstract:
PURPOSE:To protect the rear side of wafer from chemicals in the spin process of wafer by providing a plurality of perpendicular fins which are curved and extended in the radius direction at the rear side of chuck. CONSTITUTION:The fins 16 which are curved and extended almost at the entire part of length in the radius direction of chuck are provided at the rear surface of chuck. Each fin 16 is perpendicularly provided at the rear surface of chuck. Thereby, when the chuck rotates, the air flows at a high speed to the outside of chuck between the fins 16 the thereby the chemicals which are going to drop from the edge of wafer surface is blown out. Thereby, the rear surface of wafer is protected from chemicals.
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Inventors:
NISHIKATA EIJI
Application Number:
JP11313382A
Publication Date:
January 10, 1984
Filing Date:
June 30, 1982
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/683; H01L21/68; H01L21/687; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Yoshiyuki Osuge (1 outside)
Next Patent: VACUUM ATTRACTING AND FIXING MEANS