Title:
SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPS58106840
Kind Code:
A
Abstract:
PURPOSE:To provide a resin molded type semiconductor device which is excellent in moisture resistance and difficult to generate poor tab short-circuit, by interposing insulating resin between a chip and a tab. CONSTITUTION:A metallic lead frame 7, constituted of a tab 1 and a plurality of leads 4 which makes the internal end face the periphery of the tab 1, is prepared, and a chip 3 incorporated with an electric circuit is fixed on the upper surface of the tab 1 via an insulating adhesive 2. Thereafter, the electrode of the chip 3 is connected to the internal end of each lead 4 corresponded thereto by wires 5. Next, the adhesive 2 fixing the chip 3 is exfoliated by a suitable etchant, and thus the chip 3 is made to float up from the tab 1. Then, the internal end part of the lead 4, the tab 1, the chip 3 and the wire 5 are molded by a resin molding and covered with a package 6 constituted of insulating resin. Thereat, the molding is so performed in the manner that the chip 3 is in non- contact on the chip 1, and that resin 8 is interposed at the interface.
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Inventors:
SHIOZAKI YOSHIROU
Application Number:
JP20375381A
Publication Date:
June 25, 1983
Filing Date:
December 18, 1981
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/52; H01L23/28; H01L23/495; (IPC1-7): H01L23/28
Attorney, Agent or Firm:
Toshiyuki Usuda