PURPOSE: To obtain a circuit which decreases thermal resistance and reduces source inductance and matching circuit loss by thinning the substrate at the part wherein an FET is formed.
CONSTITUTION: The region wherein the FET 21 and a ground electrode 27 are formed is thinned by etching the substrate 20, and a through hole 29 is formed by etching from the surface of the substrate 20. A ground conductor 30 is provided on the back surface of the substrate including also the thinned part, and the ground electrode 27 and the source electrode S of the FET 21 connect it. The thermal resistance and the source inductance are reduced by thinning the substrate thickness in the lower part of the FET 21, and a monolithic amplifying circuit which does not increase the circuit loss can be obtained by thickly leaving the substrate at the part of a matching circuit.
IEEE TRANSACTIONS ON ELECTRON DEVECES=1981