PURPOSE: To obtain the titled device having a fine, multipin connector in module mounting by utilizing bare chips of semicondutor.

CONSTITUTION: Several pieces of wiring substrate (package) 3 loaded with LSI's, resistor chips 2, and the like are stacked, and respective substrates 3 are electrically connected with a wiring substrate (platter) 4. The connection of the package 3 with the platter 4 is made by a connector 10. Semiconductor chips 7 with logical circuits and terminal resistors are mounted to a block 6 installed on the package 3 with solder 5 and to a platter 4, respectively. These chips 7 are electrically connected to the block 6 or the platter 4 by wire bonding 8. For the purpose of connecting the substrates 3 and 4, the connector board 10 having pins 9 is press-welded to the chip 7 and then electrically connected by touching the pads on the chip with the pins 9.