Title:
FORMATION OF ELECTROCONDUCTIVE COATING
Document Type and Number:
Japanese Patent JPS60149673
Kind Code:
A
Abstract:
A solderable electrically conductive film is formed on a substrate by forming a film-forming composition comprising polyimide, solvent therefor and dispersed metallic nickel particles. This composition is applied to the substrate, dried and cured to leave the film which comprises nickel particles dispersed in polyimide.
Inventors:
FURANKU UEIN MAACHIN
FURANKU SEINTO JIYON
FURANKU SEINTO JIYON
Application Number:
JP20390884A
Publication Date:
August 07, 1985
Filing Date:
September 28, 1984
Export Citation:
Assignee:
ELECTRO MATERIALS
International Classes:
H05K3/12; C09D5/24; C09D179/08; H01B1/22; H05K1/09; (IPC1-7): C09D3/49; C09D5/24; H01B1/22; H05K3/12
Attorney, Agent or Firm:
Asamura Akira