PURPOSE: To simplify stage and to improve productivity with a titled connecting method for substrates on which wiring patterns are formed to each other by disposing low melting metallic balls into wiring holes of a protective film disposed on the substrate.

CONSTITUTION: A protective film 13 consisting of a flat silicone resin having, for example, about 0.2mm thickness is deposited and formed by screen printing on a ceramic substrate 11 on which a wiring pattern is formed and has, for example, about 0.6W0.7mm thickness. Circular columnar holes B slightly larger than about 0.3mm in diameter are patterned to meet the wiring pattern and is formed to the film 13. Solder balls 14 having about 0.3mm diameter are disposed in the holes B and are mounted on the substrate 11 and thereafter the substrate is heated to weld the balls 14 to the wiring pattern on the substrate 11. A need for a metallic mask used previously is eliminated according to the above-mentioned method. The 2nd substrate 15 is set on the balls 14 in the same way as in the prior art. The substrates 11, 15 are thus conducted through the balls 14.