Title:
LEAD PIN FOR INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPS5823465
Kind Code:
A
Abstract:
PURPOSE: To prevent oxidation during the custody of the lead pin, and to ensure the moistening of silver solder while facilitating brazing set by fitting silver solder to at least both end surfaces of the lead pin.
CONSTITUTION: The layer of the silver solder 2 consisting of 72% silver-28% copper is formed to both end surfaces 1a of the lead pin 1 composed of an iron- nickel alloy through sputtering. Accordingly, the strength of solder obtaned varied narrowly, and is high stable. Time when the lead pin is set onto a ceramic substrate is shortened.
Inventors:
MORI KENYA
Application Number:
JP12204681A
Publication Date:
February 12, 1983
Filing Date:
August 04, 1981
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND
International Classes:
H01L23/50; H01L23/49; (IPC1-7): H01L23/48
Domestic Patent References:
| JP55096661B | ||||
| JPS51130860A | 1976-11-13 |