Title:
ツールパッククランプカバー
Document Type and Number:
Japanese Patent JP7098655
Kind Code:
B2
Abstract:
A die pack mounting for a bodymaker includes a die pack mounting bed and a die pack mounting door assembly. The die pack mounting door assembly is movably coupled to the die pack mounting bed. The die pack mounting door assembly is movable between an open, first position, wherein the die pack mounting door assembly is structured to support a die pack in a maintenance configuration, and, a closed, second position, wherein the die pack mounting door assembly fixes the die pack in a selected position. Further, the die pack mounting door assembly does not include any coolant fluid fittings. That is, the die pack mounting door assembly defines internal passages for coolant and the coolant is supplied via similar passages in the die pack mounting bed.
Inventors:
Shorey, Ian Kay.
Frascher, Karl S.
Cleveland, Aland W.
Frascher, Karl S.
Cleveland, Aland W.
Application Number:
JP2019557804A
Publication Date:
July 11, 2022
Filing Date:
April 17, 2018
Export Citation:
Assignee:
Stolle Machinery Company,LLC
International Classes:
B21D22/28; B21D37/14; B21D51/26
Domestic Patent References:
| JP58100920A | ||||
| JP58099706A |
Foreign References:
| US6047587 | ||||
| US4538441 |
Attorney, Agent or Firm:
Maruyama International Patent Office
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