Title:
TRANSFER DIE, AND MANUFACTURING METHOD FOR MICROSTRUCTURE AND IMAGE DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP3835109
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for a device in massproduction furnished with microstructure by die transfer and also such a microstructure, whereby a product having a high accuracy in the molded surface can be manufactured quickly with a good yield.
SOLUTION: When a resin layer 35a to form an optical element array 3 is molded using a transfer die 60, a layer 70 for exfoliation is previously formed on the die 60 by evaporating silicon fast so that a thin film having uniform thickness is formed along the surface 62 etched into an inverted V-shape as contrary to the desired shape. The die 60 furnished with exfoliation layer 70 and a semiconductor substrate 20 are put together in such a way as pinching the resin material 35 followed by pressurizing from the two sides and ultraviolet irradiation so that the intended resin layer 35a is formed. Thereafter only the layer 70 for exfoliation is dry etched with xenon fluoride gas so that a gap 78 is formed, and the die 60 is removed. According to this arrangement, the die 60 removal can be executed easily, and resin layer 35a having a high fidelity shape can be formed without damaging the surrounding.
More Like This:
Inventors:
山▲崎▼ 哲朗
Application Number:
JP2000095413A
Publication Date:
October 18, 2006
Filing Date:
March 30, 2000
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
G02B26/08; B81C99/00; (IPC1-7): B81C5/00; G02B26/08
Domestic Patent References:
| JP11039730A | ||||
| JP4016315A | ||||
| JP9175835A | ||||
| JP9193244A | ||||
| JP8255786A | ||||
| JP10209088A | ||||
| JP11202223A | ||||
| JP1176516A |
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Osamu Suzawa