TRANSFER SHEET FOR INTEGRALLY FORMING BARRIER RIB AND DIELECTRIC LAYER, AND MANUFACTURING METHOD OF BACK SUBSTRATE FOR PLASMA DISPLAY PANEL

Title:

TRANSFER SHEET FOR INTEGRALLY FORMING BARRIER RIB AND DIELECTRIC LAYER, AND MANUFACTURING METHOD OF BACK SUBSTRATE FOR PLASMA DISPLAY PANEL

Document Type and Number:

Japanese Patent JP2005231127

Kind Code:

A

Abstract:

To provide a transfer sheet for integrally forming a barrier rib and a dielectric layer without causing a crack or breaking in the peripheral end part of a glass/resin composition layer when cutting or punching processing is applied and excellent in processability, workability and transfer properties, a manufacturing method of a back substrate for PDP using the transfer sheet, the back substrate for PDP obtained by this manufacturing method and PDP.

The transfer sheet comprises at least a viscoelastic layer A containing no inorganic powder laminated on one side of the glass/resin composition layer containing the inorganic powder and a binder resin and a base film laminated on the other surface of the glass/resin composition layer. The base film is provided with a pressure-sensitive adhesive layer on a base material.

Inventors:

HATANAKA TOSHIHIRO
BABA NORIHIDE
KUME KATSUYA
KAI MAKOTO
MUSASHIJIMA YASUSHI

Application Number:

JP2004041501A

Publication Date:

September 02, 2005

Filing Date:

February 18, 2004

Export Citation:

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Assignee:

NITTO DENKO CORP

International Classes:

B32B17/10; C03C17/42; H01J9/02; H01J11/22; H01J11/24; H01J11/34; H01J11/36; H01J11/38; (IPC1-7): B32B17/10; C03C17/42; H01J9/02; H01J11/02

Attorney, Agent or Firm:

Takao Suzuki
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi

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