To provide a highly transparent adhesive resin composition for wiring boards wherein transparency and heat resistance are required, and a transparent adhesive film for wiring boards using the same.

The transparent adhesive resin composition for wiring boards comprises 5-40 pts.mass acrylate compound (B) and 100 pts.mass polyvinyl butyral resin (A), and 0.1-10 pts.mass radical photopolymerization initiator (C) based on 100 pts.mass acrylate compound (B). Here, the acrylate compound (B) has a functional group having a functionality of 2 or higher, and contains no benzene ring and has an acid number of 3 mgKOH/g or less, and the polyvinyl butyral resin (A) has a degree of acetalization of 70-85 mass%, a vinyl acetate content of 1-15 mass% and a Tg (glass transition temperature) measured by DSC (differential scanning calorimetry: temperature rising rate of 10°C/min) of ≥65°C. The transparent adhesive film for wiring boards is a film formed from the same.