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Title:
TRANSPARENT CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING TRANSPARENT CONDUCTIVE SUBSTRATE
Document Type and Number:
Japanese Patent JP2012252856
Kind Code:
A
Abstract:

To provide a transparent conductive substrate having a low resistance value, excellent current uniformity, no deterioration in conductivity after long-term storage, and high stability, and capable of being manufactured with a simple method, and a method for manufacturing the transparent conductive substrate.

In forming a transparent conductive substrate 1, a metal-containing fine wire electrode 3 and a conductive polymer-containing layer 4 are formed on a substrate 2, the fine wire electrode 3 is formed of a conductive ink containing metal particles and a solvent, the conductive ink is applied on the substrate 2, and then the substrate is heated at a firing temperature T0 (°C) of the conductive ink for S2 (min) after having been heated at a temperature T1 (°C), which is lower than the firing temperature T0 (°C) and is higher than a volatilization temperature ST (°C) of the component of the conductive ink, for S1 (min). A difference between the firing temperature T0 (°C) and the temperature T1 (°C) higher than the volatilization temperature of the solvent satisfies a relationship of 200°C>T0-T1>50°C.


Inventors:
TAKEYAMA TOMOKO
TAKEDA AKIHIKO
Application Number:
JP2011124045A
Publication Date:
December 20, 2012
Filing Date:
June 02, 2011
Export Citation:
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Assignee:
KONICA MINOLTA HOLDINGS INC
International Classes:
H01B13/00; C08F220/26; C08F220/58; G09F9/30; H01B5/14; H01L51/50; H05B33/02; H05B33/10; H05B33/14; H05B33/26; H05B33/28; H05K3/12; H01L51/42