Title:
透明導電性基板
Document Type and Number:
Japanese Patent JP5090040
Kind Code:
B2
Abstract:
To provide a plastic substrate for a display element with excellent heat resistance, chemical resistance, and a low average coefficient of linear expansion, and yet, with high transparency, and hardly being affected by warping, deformation, or crack of wiring in a thin film device forming process.
The transparent conductive substrate is structured by using allyl ester thermosetting resin containing a compound having a group expressed in general formula (3) as a repeating unit. In the formula, A
COPYRIGHT: (C)2008,JPO&INPIT
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Inventors:
Yasushi Kadowaki
Kazushi Kai
Kazushi Kai
Application Number:
JP2007086263A
Publication Date:
December 05, 2012
Filing Date:
March 29, 2007
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
H01B5/14; C08F18/16; C08F20/10; C08F299/04; G02F1/1333; H01L51/50; H05B33/28
Domestic Patent References:
JP2000330098A | ||||
JP3309851B2 | ||||
JP2003012722A | ||||
JP7168166A | ||||
JP4100001A | ||||
JP3115415A |
Attorney, Agent or Firm:
Kunihisa Landlord
Atsushi Hayashi
Atsushi Hayashi