Transparent material processing by a super-short pulse laser

Japanese Patent JP6034269

B2

Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

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Arai, Alan, Wai.
Cho, Gyu, Sea.
Sue, Jinzo
Yoshino Ikuyo
Zhang, Hai Bin
James Bovatosec

JP2013191702A

November 30, 2016

September 17, 2013

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Imra America Inc.

B23K26/40; B23K26/00; B23K26/042; B23K26/064; B23K26/067; B23K26/21; B23K26/53; C03B33/09; H01L21/301

JP2006305586A
JP2005288503A
JP2007190587A
JP2006525874A
JP2004337902A
JP2006061954A
JP2007530292A
JP11267861A
JP2007075886A
JP2006320938A
JP2007324326A
JP2007253156A
JP2007319921A
JP2006088199A

US20070051706

Okabe
Koji Yoshizawa
Katsumi Miyama

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