To enhance treatment efficiency while controlling the scattering of liquid drops from a substrate being treated to the surroundings by downsizing and simplifying a spinner system.

A cleaning cup 92 having an open upper surface is provided as a treatment container in which a brush mechanism 102 and a nozzle mechanism 104 are juxtaposed. A rotatable negative pressure suction type chuck plate 114 is disposed on the cleaning cup 92 oppositely to the central part thereof while being directed reversely, i.e., directing the suction holding face 114a downward. In such an arrangement, the chuck plate 114 holds a wafer W while directing the surface thereof downward as the surface being cleaned on the inside of the cleaning cup 92 and the lower surface (the surface being cleaned) of the wafer W is subjected to scrubbing or liquid treatment by operating the brush mechanism 102 and the nozzle mechanism 104 disposed in the cap 92 while spinning the wafer W by a spin chuck drive section 118.