Title:
TREATMENT METHOD AND TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP3856125
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a treatment method and a device, which are capable of keeping the device small in size and continuously treating a plurality of works under different processing conditions.
SOLUTION: The treating device is equipped with thermal treatment units 70a to 70c which serve as a first treatment unit and are set at processing conditions under which a preceding substrate G is treated and at least an auxiliary thermal treatment unit 70s which serves as a second treatment unit and is set at processing conditions under which a following substrate G is treated. The second treatment unit is set at the processing conditions under which the following substrate G is treated and kept on standby while the preceding substrate G is transferred to the first treatment unit and thermally treated. After the thermal treatment of the preceding substrate G is finished in the first treatment unit, then the following substrate G is treated in the second treatment unit. While the substrate G is treated in the second treatment unit, the first treatment units are changed to the same conditions with the second treatment unit to treat the following substrate G. After the treatment of the substrate G is finished in the second treatment unit, the second treatment unit is changed to a following processing condition under which the following substrate G is treated and kept on standby, and thus a plurality of the substrates G are successively treated.
Inventors:
Kiyohisa Tateyama
Application Number:
JP2002134882A
Publication Date:
December 13, 2006
Filing Date:
May 10, 2002
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; G03D3/00; (IPC1-7): H01L21/027
Domestic Patent References:
| JP11054587A | ||||
| JP10030317A | ||||
| JP11204413A | ||||
| JP2001358045A |
Attorney, Agent or Firm:
Kikuhiko Nakamoto